| 摘要 |
<p>An image pickup device (10), which is a semiconductor device, is provided with: a semiconductor chip (20) comprising a light reception section (21); a frame-shaped spacer (30) arranged on the semiconductor chip (20) so as to surround the light reception section (21); a transparent plate section (40) that is arranged on the semiconductor chip (20) with the spacer (30) interposed therebetween, and that has planar-view dimensions that are greater than those of the spacer (30) and smaller than those of the semiconductor chip (20); and a reinforcement member (50) that is for filling up the gap between the semiconductor chip (20) and the transparent plate section (40), outside the spacer (30), and that has planar-view dimensions that are greater than those of the transparent plate section (40) and smaller than those of the semiconductor chip (20).</p> |
