发明名称 SUBSTRATE JOINING METHOD USING RIVET, AND JOINING STRUCTURE
摘要 The present invention makes it possible join substrates by rivet punching in such a manner that peeling and cracking are suppressed. The invention is a method of joining laminated substrates (CFRP) (1, 3) using SPRs (self piercing rivets) (5), with the laminated substrates (CFRP) (1,3) being punched by a rivet axle portion (15) of the SPRs (5), a crimp portion (17) being formed on the end of the rivet axle portion (15), and the laminated substrates (CFRP) (1, 3) being fastened and joined between a rivet head portion (19) and the crimp portion (17) The method is characterized in that metal washers (7, 9) that have inner holes (31) through which the rivet axle portion (15) can pass are stacked on and caused to abut non-joining surfaces (27, 29) of the laminated substrates (CFRP) (1, 3); the metal washers (7, 9) are used as a jig when punching out; the punching of the rivet axle portion (15) matches the inner holes (31) of the metal washers (7, 9); and that the joining is performed leaving the respective metal washers (7, 9) between the rivet head portion (19) or crimping portion (17), and the non-joining surfaces (27, 29).
申请公布号 WO2012117737(A1) 申请公布日期 2012.09.07
申请号 WO2012JP01424 申请日期 2012.03.01
申请人 NIHON UNIVERSITY;FUKUI BYORA CO., LTD.;UEDA, MASAHITO;HASEGAWA, HIROYUKI;WATANABE, KINYA;FUJII, NAOYA 发明人 UEDA, MASAHITO;HASEGAWA, HIROYUKI;WATANABE, KINYA;FUJII, NAOYA
分类号 F16B5/04;F16B19/08 主分类号 F16B5/04
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