| 摘要 |
<p>Provided are: a thermosetting resin composition a hardened material of which has high hardness, which has excellent heat resistant colorability, ultraviolet resistant colorability, strength and flexibility, which causes less damage to a package under a heat cycle, and which is suitable in the field of electronic materials or for optical semiconductor encapsulation; and an epoxy silicone resin suitable therefor. This epoxy silicone resin is represented by general formula (1) and has an epoxy equivalent of 170-2000 g/eq. This thermosetting resin composition comprises this epoxy silicone resin (A) as an epoxy resin component, a hardener (B) and a hardening accelerator (C). (In the formula, R1 represents a hydrocarbon group, m represents a number of 01 is a diglycidyl isocyanuryl-propyl group represented by formula (2), and Z is a divalent organic residue in which both termini are carbon atoms and which contains an Si atom inside.)</p> |
