| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid resin composition for sealing having all of high thermal conductivity, low permittivity, and high ability to penetrate into spaces. <P>SOLUTION: The liquid resin composition for sealing, which is used when sealing a clearance between a semiconductor element and a substrate after bump-connecting the semiconductor and the substrate together, includes: (A) an epoxy resin; (B) a hardener; (C) an inorganic filler containing a mixture of spherical alumina and spherical silica; and (D) a basic compound. Preferably, the liquid resin composition for sealing has a pH not less than 7. <P>COPYRIGHT: (C)2012,JPO&INPIT |
