| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive material capable of hardly generating voids in a cured product layer formed by curing the anisotropic conductive material. <P>SOLUTION: An anisotropic conductive material according to the present invention comprises: a thermosetting compound; a thermosetting agent; a conductive particle 5; and a filler. The conductive particle 5 includes a resin particle and a conductive layer arranged on a surface of the resin particle. A surface layer at least on an external side of the conductive layer is a solder layer. The filler is a nano filler having an average particle size of a primary particle of 5 nm or more and 800 nm or less, or a filler having a reactive functional group on a surface thereof. In the anisotropic conductive material according to the present invention, a temperature exhibiting a minimum melt viscosity in a measuring temperature range of 40-300°C is in a temperature range of 60-120°C, and the minimum melt viscosity is 1 Pa s or more. <P>COPYRIGHT: (C)2012,JPO&INPIT |
