| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the occurence of residual resists when the resist formed on a substrate is removed and to reduce the deterioration of cleaning capability when the substrate is cleaned. <P>SOLUTION: An injection object injecting apparatus comprises: a spinner 40 having a rotation shaft 41 and rotating a substrate through the rotation of the rotation shaft 41; and nozzles 24 and 25 which are disposed at positions facing the substrate and deviated from the rotation shaft 41 of the spinner 40 and inject injection objects. When viewed in the rotation direction of the rotation shaft 41 of the spinner 40, an injection port 24A of the nozzle 24 faces in the rotation direction of the rotation shaft 41 of the spinner 40, and an injection port 25A of the nozzle 25 faces in the opposite direction from the injection port 24A of the first nozzle 24. <P>COPYRIGHT: (C)2012,JPO&INPIT |
