| 摘要 |
PURPOSE: An inline reflow device using a laser module and a reflow method thereof are provided to improve workability and productivity by successively and continuously a temperature profile using the laser module. CONSTITUTION: A load unit(110) loads a plurality of printed circuit boards(P). An arrangement inspecting unit(120) inspects a defect of the printed circuit board. A flux dotting unit(130) forms a flux at a position corresponding to a solder ball(S). A solder ball mounter(140) is arranged on the upper side of the printed circuit board. A preheating unit(150) preheats the printed circuit board at 120 to 170 degrees centigrade. |
