| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize improvement of manufacturing efficiency, a reduction in cost, improvement of reliability, and a reduction in size. <P>SOLUTION: A solid-state imaging device is configured in which a sensor component 100 is bonded via a bonding layer 501 to a first glass substrate 301A, a surface of which opposite to the sensor component 100 is provided with a light-shielding layer 311. A second glass substrate 301B is arranged so as to face the first glass substrate 301A via the light-shielding layer 311. <P>COPYRIGHT: (C)2012,JPO&INPIT |
