| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents displacement between a lead and a connection plate during soldering. <P>SOLUTION: A semiconductor device 1 includes: a semiconductor chip 10, a conductive connection plate 20 having one end 21 connected with the semiconductor chip; and a conductive plate like lead 40 disposed so as to be spaced away from the semiconductor chip and joined to the other end 22 of the connection plate by a solder part 30. A protruding part 43, protruding from an outer peripheral surface in the plate thickness direction Y, is formed at a joined part 63, where the connection plate and the lead are joined by the solder part, in one of the connection plate and the lead. Further, a recessed part 23, engaging with the protruding part, is formed in the other of the connection plate and the lead. <P>COPYRIGHT: (C)2012,JPO&INPIT |
