| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device which improves heat radiation. <P>SOLUTION: A hybrid integrated circuit device 10A of the present invention includes: a circuit board 12; a control element 23 and a chip element 24 which are disposed on an upper surface of the circuit board 12; an opening 18 formed by partially opening the circuit board 12; a mount board 28 covering the opening 18 from a lower surface; and a power element 22 mounted on an upper surface of the mount board 28. The power element 22 is mounted on the mount board 28 made of a material having higher heat conductivity than the circuit board 12. This structure allows heat generated from the power element 22 to be radiated effectively to the exterior through the mount board 28. <P>COPYRIGHT: (C)2012,JPO&INPIT |
