| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such a problem that, in a step for peeling a heat-resistant adhesive tape 2 for manufacturing a semiconductor device from a chip, light peeling is required after resin sealing and resin curing, therefore, a general pressure-sensitive adhesive that is highly-viscous at high temperatures is not light-peeled to preclude peeling when the adhesive is peeled, adhesive is left behind as shown in Fig.2, or peeling causes static buildup. <P>SOLUTION: The substrate-free heat-resistant adhesive tape for manufacturing a semiconductor device is an adhesive tape for temporarily immobilizing a semiconductor chip, which tape is stuck and used when the semiconductor chip is resin-sealed, and is characterized by including a thermally-expandable adhesive layer containing thermally-expandable microspheres on one surface of a resin layer containing a urethane polymer component and a vinyl-based polymer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
