发明名称 |
INNER-LAYER HEAT-DISSIPATING BOARD, MULTI-CHIP STACK PACKAGE STRUCTURE HAVING THE INNER LAYER HEAT-DISSIPATING BOARD AND FABRICATION METHOD THEREOF |
摘要 |
An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal board body formed with a plurality of penetrating conductive through holes each comprising a plurality of nano wires and an oxidative block having nano apertures filled with the nano wires. The multi-chip stack package structure includes a first chip and an electronic component respectively disposed on the inner-layer heat-dissipating board to thereby facilitate heat dissipation in the multi-chip stack structure as well as increase the overall package rigidity.
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申请公布号 |
US2012224328(A1) |
申请公布日期 |
2012.09.06 |
申请号 |
US201113112253 |
申请日期 |
2011.05.20 |
申请人 |
HUANG HUEI-NUAN;HUANG PIN-CHENG;LU CHUN-HUNG;CHAO CHUN-CHIEH;CHIU CHI-HSIN;SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
HUANG HUEI-NUAN;HUANG PIN-CHENG;LU CHUN-HUNG;CHAO CHUN-CHIEH;CHIU CHI-HSIN |
分类号 |
H05K7/20;B82Y99/00;H05K1/02;H05K3/32 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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