| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board firable at 1,000°C or lower, formable of a wiring layer containing low-resistance metal by simultaneous firing, and having high mounting reliability. <P>SOLUTION: The glass ceramic composition includes 40-65 mass% of SiO<SB POS="POST">2</SB>, 5-20 mass% of B<SB POS="POST">2</SB>O<SB POS="POST">3</SB>, 10-20 mass% of Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>, and 10-45 mass% of the total of at least one type of alkaline earth metal oxides as essential components, as well as 40-70 mass% of amorphous glass powder that is not crystallized during heat treatment at 1,000°C or lower, and 30-60 mass% of at least one type of filler powder selected from the group consisting of cordierite, mullite, and silica glass. <P>COPYRIGHT: (C)2012,JPO&INPIT |
