发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which variation in electric characteristics is hard to occur and which has excellent electric characteristics, and a manufacturing method of the semiconductor device. <P>SOLUTION: A semiconductor device manufacturing method comprises: forming a ground insulation film on a substrate; forming a first oxide semiconductor film on the ground insulation film; forming a second oxide semiconductor film by performing first heating processing after forming the first oxide semiconductor film; subsequently forming a third oxide semiconductor film by performing preferential etching; forming an insulation film on a first insulation film and the third oxide semiconductor film; forming sidewall insulation films contacting at least lateral faces of the third oxide semiconductor film by polishing a surface of the insulation film so as to expose a surface of the third oxide semiconductor film; subsequently, forming a source electrode and a drain electrode on the sidewall insulation films and the third oxide semiconductor film; and forming a gate insulation film and a gate electrode. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012169606(A) 申请公布日期 2012.09.06
申请号 JP20120011719 申请日期 2012.01.24
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;FUJII TERUYUKI;NAGAMATSU SHO
分类号 H01L29/786;H01L21/28;H01L21/336;H01L21/8242;H01L21/8247;H01L27/10;H01L27/105;H01L27/108;H01L27/115;H01L27/14;H01L27/146;H01L29/417;H01L29/788;H01L29/792 主分类号 H01L29/786
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