| 发明名称 |
MOISTURE BARRIER FOR A WIRE BOND |
| 摘要 |
An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad. The device further comprises an intermetallic compound interface located between the bond pad and the wire and a silicon nitride or silicon carbonyl layer covering the intermetallic compound interface
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| 申请公布号 |
US2012223432(A1) |
申请公布日期 |
2012.09.06 |
| 申请号 |
US201113037836 |
申请日期 |
2011.03.01 |
| 申请人 |
DELUCCA JOHN M.;BAIOCCHI FRANK A.;WEACHOCK RONALD J.;OSENBACH JOHN W.;DUTT BARRY J.;LSI CORPORATION |
发明人 |
DELUCCA JOHN M.;BAIOCCHI FRANK A.;WEACHOCK RONALD J.;OSENBACH JOHN W.;DUTT BARRY J. |
| 分类号 |
H01L23/49;H01L21/60 |
主分类号 |
H01L23/49 |
| 代理机构 |
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代理人 |
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