| 摘要 |
To provide a wafer, a method of manufacturing a package, and a piezoelectric oscillator in which warping of a wafer body is reduced to improve the yields. A wafer for lid substrate has a product region in which a number of recess portions for cavities are formed and a non-forming region of the recess portions set in the product region in the form of a straight line extending along a diameter direction of the product region. |
