| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small sensor device capable of relaxing stress to, for example, impact given from the outside, a motion sensor, and electronic equipment using the sensor device and the motion sensor. <P>SOLUTION: An IC chip 10 serving as a semiconductor device includes a first electrode 11, a projection electrode 12, and an insulating film 14 stacked between an active surface 10a and the projection electrode 12. On the part of the insulating film 14 which corresponds to an extraction electrode 29 of a vibration gyro element 20, the projection electrode 12 formed of a resin projection 12a made of elastic insulating resin and a metal film 17 serving as a conductive film provided on the surface of each region projection 12a is arranged. The metal film 17 is connected to an interconnect 16 extracted from a first electrode 11 in each opening 14a of the insulating film 14 onto the insulating film 14. The projection electrode 12 is aligned with the corresponding extraction electrode 29 of the vibration gyro element 20, and is boned thereto by a conductive jointing material 98. <P>COPYRIGHT: (C)2012,JPO&INPIT |
