摘要 |
In a many-up wiring substrate including a base substrate having dividing grooves formed as part of main surfaces thereof, along boundaries of a plurality of wiring substrate regions, the plurality of wiring substrate regions being arranged in a matrix, when seen in a transparent plan view, dividing grooves of the main surface and dividing grooves of an opposite main surface are formed to be deviated in one direction of transverse direction or longitudinal direction, and a distance between bottoms of the dividing grooves of one main surface and bottoms of the dividing grooves of the opposite main surface is smaller than a distance between the bottoms of the dividing grooves of the one main surface and the opposite main surface and a distance between the bottoms of the dividing grooves of the opposite main surface and the one main surface.
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