Microelectromechanical systems transducer device mounted to circuit board comprises package substrate having first coefficient of thermal expansion, and transducer substrate comprising transducer and disposed over package substrate

摘要

A microelectromechanical systems (MEMS) transducer device (200) mounted to a circuit board comprises a package substrate (101) having a first coefficient of thermal expansion (CTE); and a transducer substrate (102) comprising a transducer. The transducer substrate is disposed over the package substrate, and has a second CTE that substantially matches the first CTE.