| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high frequency module in which a high frequency IC may be checked, even after completion of the module, to confirm whether or not it may be operated with designed characteristics. <P>SOLUTION: A high frequency module 10 comprises: a layered body including a plurality of dielectric layers having an electrode pattern thereon; and a switching element 11 integrally mounted on the surface of the layered body and having a test terminal PT for outputting a negative voltage applied to the switching element 11. The layered body has, on a rear face thereof, a test external terminal PTest for external connection used in outputting a signal to the outside. The layered body further includes a voltage transmitting route for electrically connecting the test terminal PT and the test external terminal PTest to each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
