COMPONENT DELIVERY MECHANISM, PLASMA REACTOR, AND SEMICONDUCTOR SUBSTRATE PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a component delivery mechanism for distributing a component inside a process chamber for producing uniform processing on a surface of a substrate.

SOLUTION: The component is used to process a work piece 18 within a process chamber 12. The component delivery mechanism 75 includes a plurality of component output parts for outputting the component to a desired region of the process chamber. The component delivery mechanism further includes a spatial distribution switches 40, 56 coupled to the plurality of component output parts. The spatial distribution switch is arranged for directing the component to at least one of the plurality of component output parts. The component delivery mechanism also includes a single component source 36 connected to the spatial distribution switch. The single component source is arranged for supplying the component to the spatial distribution switch.

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