发明名称 ISOLATION STRUCTURES FOR INTEGRATED CIRCUITS AND MODULAR METHODS OF FORMING THE SAME
摘要 <p>Isolation structures for isolating semiconductor devices from a substrate include floor isolation regions buried within the substrate and one or more trenches extending from a surface of the substrate to the buried floor isolation region.</p>
申请公布号 KR101180525(B1) 申请公布日期 2012.09.06
申请号 KR20087031002 申请日期 2007.05.30
申请人 发明人
分类号 H01L21/76 主分类号 H01L21/76
代理机构 代理人
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