ADHESIVE SHEET FOR WAFER PROCESSING, MARKING METHOD USING THAT SHEET AND MANUFACTURING METHOD OF MARKING CHIP

摘要

PROBLEM TO BE SOLVED: To provide an adhesive sheet for wafer processing capable of preventing degradation of marking aptitude or contamination of a semiconductor device by removing gaseous contaminants generated by thermal decomposition of a wafer or a protective film efficiently, when marking the rear surface or the protective film by pasting the rear surface of a semiconductor wafer or the protective film side of a wafer with a protective film to the adhesive sheet and then radiating laser light from the adhesive sheet side.

SOLUTION: The adhesive sheet for wafer processing has a through hole, and the light transmittance thereof for the wavelength of 532-1064 nm is 70% or higher.

COPYRIGHT: (C)2012,JPO&INPIT