| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve cooling performance using phase change of a coolant in an ebullient cooling device. <P>SOLUTION: An ebullient cooling device is provided with: a housing 14 having a cooling tank 16 enclosing a coolant 18 cooling a semiconductor module 12 which is a heating element; hollow parts 30 provided in a side wall 14b and a bottom plate 14a of the housing 14 that the coolant 18 in the cooling tank 16 contacts with; and a heat storage agent 32 enclosed in the hollow parts 30. Further, radiation fins 38 are provided on outer surfaces of the side wall 14b and the bottom plate 14a of the housing 14 and a heat exchanger 26, which condenses a vapor produced by evaporating the coolant 18 in the cooling tank 16, is provided. <P>COPYRIGHT: (C)2012,JPO&INPIT |
