发明名称 SUBSTRATE WITH PIEZOELECTRIC FILM, METHOD FOR MANUFACTURING THE SAME AND FILM FORMING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a high quality substrate with piezoelectric film which can suppress in-plane dispersion of a film thickness, and is excellent in piezoelectric characteristics, and a method for manufacturing the substrate with the piezoelectric film and a film forming device. <P>SOLUTION: The substrate 10 with the piezoelectric film includes the substrate 3 having a circular shape in planar view and a diameter of 4 inches or more, a base layer provided on the substrate 3, and the piezoelectric film 1 provided on the base layer and composed by using a piezoelectric material having a niobium oxide-based perovskite structure. The piezoelectric film 1 has a thickness of 0.3 &mu;m or more and 10 &mu;m or less, and the standard deviation of the film thickness of the piezoelectric film 1 in the in-plane piezoelectric film 1 and the mean value of the film thickness satisfy a relational expression: the standard deviation/the mean value&le;0.03. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012167316(A) 申请公布日期 2012.09.06
申请号 JP20110028558 申请日期 2011.02.14
申请人 HITACHI CABLE LTD 发明人 WATANABE KAZUTOSHI;SHIBATA KENJI;SUENAGA KAZUFUMI;NOMOTO AKIRA;HORIKIRI FUMIMASA
分类号 C23C14/08;H01L41/08;H01L41/09;H01L41/18;H01L41/22;H01L41/24 主分类号 C23C14/08
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