| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device having a configuration capable of improving performance by reducing variation of initial displacement of a vibration film that occurs at parts where a boundary condition of a junction area or the like is different, in a capacitance type electromechanical conversion device manufactured by fusion junction. <P>SOLUTION: The capacitance type electromechanical conversion device has an element 101 including at least one cell structure 102 formed of a silicon substrate 1, a vibration film 7 and a vibration film support 17 for supporting the vibration film 7 so as to form a gap 3 between one surface of the silicon substrate 1 and the vibration film 7. Around the element 101, a groove 103 formed in a layer 2 in common to the vibration film support 17 is disposed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
