| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device in which a structure for connecting semiconductor elements of a power system is simplified. <P>SOLUTION: Transistors are interconnected via a lead. More specifically, lower surface electrodes of transistors Q1-Q3 are connected with a land 16B provided on a lead 16, and lower surface electrodes of transistors Q4-Q6 are connected, respectively, with lands 17B-19B provided on leads 17-19. Connections 17C-19C provided on the leads 17-19 are connected with upper surface electrodes of the transistors Q1-Q3 so that the transistors Q1-Q3 and the transistors Q4-Q6 are interconnected. <P>COPYRIGHT: (C)2012,JPO&INPIT |
