发明名称 |
Light-Emitting Diode Module, Backlight Assembly Having the LED Module and Display Device Having the Backlight Assembly |
摘要 |
A backlight assembly includes a light-emitting diode (LED) module and a bottom chassis. The LED module includes an LED package in which at least one LED chip is mounted, and first and second wire sockets respectively making contact with lead frames formed at two sides of the LED package. The bottom chassis has a coupling hole formed through a bottom portion for receiving a coupling hook of the LED module. Thus, a wire socket is configured to make contact with a lead frame formed at a side portion of an LED package and power is received through a wire inserted through the wire socket, so that an additional printed circuit board (PCB) or an additional flexible printed circuit board (FPCB) for providing the LED package with power may be omitted.
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申请公布号 |
US2012224119(A1) |
申请公布日期 |
2012.09.06 |
申请号 |
US201113224169 |
申请日期 |
2011.09.01 |
申请人 |
CHO JOO-WOAN;LEE YONG-WOO;KIM HYOUNG-JOO |
发明人 |
CHO JOO-WOAN;LEE YONG-WOO;KIM HYOUNG-JOO |
分类号 |
G02F1/13357;F21V19/00;G09F13/04 |
主分类号 |
G02F1/13357 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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