| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an attachable integrated circuit package-in-package system. <P>SOLUTION: In an attachable integrated circuit package-in-package system 100, an adhesion spacer 208 is attached on an integrated circuit die 202 and above a package substrate 204, and an integrated circuit package system 106 having an inner adhesive structure 218 is attached on the adhesion spacer 208 by using the inner adhesive structure 218. Then, a package sealing 102 is formed for covering the integrated circuit package system 106 on the adhesive spacer 208. <P>COPYRIGHT: (C)2012,JPO&INPIT |
