| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a base material ensuring strong bonding of vias and a wiring board when multilayered, and to provide a wiring board, a production method of a base material, and a production method of a wiring board. <P>SOLUTION: The substrate includes a resin layer 100, wiring layers 101-107 buried in the upper surface of the resin layer 100, and semi-cured vias 108, 109 having a sintering temperature equal to or lower than the softening temperature of the resin layer 100, and having one end in contact with the wiring layers 102, 106 and the other end exposed from the lower surface of the resin layer 100. <P>COPYRIGHT: (C)2012,JPO&INPIT |
