发明名称 ELECTRICAL BYPASS STRUCTURE FOR MEMS DEVICE
摘要 An apparatus including a bypass structure for complementary metal-oxide-semiconductor (CMOS) and/or microelectromechanical system (MEMS) devices, and method for fabricating such apparatus, is disclosed. An exemplary apparatus includes a first substrate; a second substrate that includes a MEMS device; an insulator disposed between the first substrate and the second substrate; and an electrical bypass structure disposed in the insulator layer that contacts a portion of the first substrate, wherein the electrical bypass structure is electrically isolated from the MEMS device in the second substrate and any device included in the first substrate.
申请公布号 US2012223613(A1) 申请公布日期 2012.09.06
申请号 US201113195243 申请日期 2011.08.01
申请人 HUNG CHIA-MING;WANG HUNG-SEN;CHEN HSIANG-FU;LEE TE-HSI;KALNITSKY ALEX;TAI WEN-CHUAN;CHANG KUEI-SUNG;TSAI YI HENG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 HUNG CHIA-MING;WANG HUNG-SEN;CHEN HSIANG-FU;LEE TE-HSI;KALNITSKY ALEX;TAI WEN-CHUAN;CHANG KUEI-SUNG;TSAI YI HENG
分类号 H02N11/00;H05K3/36 主分类号 H02N11/00
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