| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an insulating resin material for a wiring board capable of providing a multi-layer wiring board of a build-up system which shows high adhesion with an electroless plating even on an smooth resin surface, is excellent in processability and heat resistance, can form a minute circuit and has high reliability and further to provide the multi-layer wiring board and a method for manufacturing the multi-layer wiring board. <P>SOLUTION: The insulating resin material for the wiring board has an insulating resin layer (A) and a bonding auxiliary layer (B). The insulating resin layer (A) is a layer containing a polyfunctional epoxy resin (a-1), an epoxy resin curing agent (a-2) and an inorganic filler (a-3). The bonding auxiliary layer (B) contains a polyfunctional epoxy resin (b-1), a prereaction product of an epoxy resin curing agent (b-2) and a crosslinking organic filler (b-3) with an average primary particle diameter of 1 μm or less and has thickness of 1 to 10 μm. <P>COPYRIGHT: (C)2012,JPO&INPIT |
