发明名称 DEPOSITION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To replace the atmosphere easily when the treatment gas is switched in the deposition process where a film is deposited on a plurality of substrates mounted, in the shelf-shape, on a substrate holder by supplying a plurality of kinds of treatment gas, reacting each other, in order. <P>SOLUTION: Apart from first gas injectors 51a, 51b formed, respectively, at gas discharge ports 52 for supplying treatment gas, such as Zr-based gas or O<SB POS="POST">3</SB>gas, into a reaction tube 12, a third gas injector 51c having a slit 50 formed in the length direction of the reaction tube 12 is provided. When switching the treatment gas, atmosphere in the reaction tube 12 is replaced by supplying a purge gas into the reaction tube 12 from the slit 50. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012169307(A) 申请公布日期 2012.09.06
申请号 JP20110026400 申请日期 2011.02.09
申请人 TOKYO ELECTRON LTD 发明人 MOROZUMI YUICHIRO;SATO IZUMI;ASARI SHINJI
分类号 H01L21/31;C23C16/455;H01L21/314;H01L21/316 主分类号 H01L21/31
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