| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive preparation package is free of occurrence of pinholes in a heat-sealed portion and can maintain superior air-tightness and sterility. <P>SOLUTION: In the adhesive preparation package, a packaging film encloses an adhesive preparation, and the packaging film is heat-sealed around the adhesive preparation. The heat-sealed portion of the packaging film comprises an embossed heat-sealed portion and a flat heat-sealed portion, and the embossed heat-sealed portion and the flat heat-sealed portion each form a pattern surrounding the periphery of the adhesive preparation. <P>COPYRIGHT: (C)2012,JPO&INPIT |
