发明名称 WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method which can efficiently manufacture a highly reliable wiring board provided with a highly reliable conductive pattern in which cracks, disconnection, a short circuit and the like are prevented from occurring. <P>SOLUTION: A wiring board manufacturing method of the present invention comprises: a ceramic compact preparation step of preparing a sheet-like ceramic compact composed of a ceramic material and a material containing a binder; a conductor pattern precursor formation step of forming a conductor pattern precursor by discharging a conductor pattern formation ink containing a metallic particle, an organic component, and acid or base to the ceramic compact by using a droplet discharge method; a laminate step of obtaining a laminate by laminating a plurality of the ceramic compacts; and a calcination step of calcining the laminate to obtain a wiring board having a conductor pattern and a ceramic substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012169372(A) 申请公布日期 2012.09.06
申请号 JP20110027746 申请日期 2011.02.10
申请人 SEIKO EPSON CORP 发明人 TOYODA NAOYUKI;TANABE KENTARO;HAMA YOSHIKAZU
分类号 H05K3/10;H05K3/12 主分类号 H05K3/10
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