| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable optical coupling type semiconductor element. <P>SOLUTION: The optical coupling type semiconductor element of this invention includes: a light emitting element 101; a light receiving element 102 disposed at a position optically facing the light emitting element 101; a primary mold resin layer (first resin layer) 103 for integrally sealing the light emitting element 101 and the light receiving element 102; and a secondary mold resin layer (second resin layer) 104 for covering the primary mold resin layer 103 in order to include the light emitting element 101 and the light receiving element 102. When a thermal expansion coefficient of the primary mold resin layer 103 at 23°C is defined as α<SB POS="POST">A</SB>and a thermal expansion coefficient of the secondary mold resin layer 104 is defined as α<SB POS="POST">B</SB>, the optical coupling type semiconductor element satisfies 1.0<α<SB POS="POST">A</SB>/α<SB POS="POST">B</SB>≤1.3. Also, the secondary mold resin layer 104 is formed by hardening a resin composition whose melt viscosity at 175°C measured using a Koka-type flow tester is equal to or lower than 15 Pa s. <P>COPYRIGHT: (C)2012,JPO&INPIT |
