发明名称 |
LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD SURFACE MOUNT COMPONENTS |
摘要 |
A standoff contact array is disposed between a mounting substrate of a flip-chip package and a board. The standoff contact array is formable by mating a low-profile solder bump on the mounting substrate with a low-profile solder paste on the board. Thereafter, the standoff contact array is formed by reflowing the low-profile solder paste on the board against the low-profile solder bump on the mounting substrate. |
申请公布号 |
US2012224331(A1) |
申请公布日期 |
2012.09.06 |
申请号 |
US201213473847 |
申请日期 |
2012.05.17 |
申请人 |
ROTH WESTON;BYRD KEVIN;SEARLS DAMION;JACKSON JAMES D. |
发明人 |
ROTH WESTON;BYRD KEVIN;SEARLS DAMION;JACKSON JAMES D. |
分类号 |
H05K7/00 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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