| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a deposition method in which, even when thick aluminum is deposited on a thin base material, the base material is hardly deflected. <P>SOLUTION: In the deposition method, a base material is arranged on an electrostatic chuck, a first layer of aluminum is deposited on the base material while a bias is not applied on the electrostatic chuck, then the bias is applied on the electrostatic chuck so that the base material is brought into close contact with the support and a second layer of aluminum thicker than the first layer is deposited to be continuous with the first layer at a base material temperature of less than 22°C. <P>COPYRIGHT: (C)2012,JPO&INPIT |
