发明名称 POLISHING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of maintaining polishing precision although fewer expendable parts are periodically replaced. <P>SOLUTION: The polishing apparatus includes: a polishing lap 20 having a polishing surface 20a at the front side thereof to polish an end surface of a workpiece; a support mechanism 30 for supporting a rear surface 20b of the polishing lap 20 while allowing the movement of the polishing lap 20 on a predetermined plane; a workpiece holder 50 for holding the workpiece in a manner that the end surface of the workpiece makes contact with the polishing surface of the polishing lap; and a driving mechanism 70 for linearly reciprocating the polishing lap while rotating the polishing lap 20. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012166327(A) 申请公布日期 2012.09.06
申请号 JP20110031308 申请日期 2011.02.16
申请人 NTT ADVANCED TECHNOLOGY CORP;TEITSU ENGINEERING CO LTD 发明人 ANDO KAZUTOSHI;KIMURA TOSHINORI;MIZUNO SADAAKI
分类号 B24B19/00;B24B41/06 主分类号 B24B19/00
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