| 摘要 |
A method of forming a semiconductor device, including exposing a first shot to light on a semiconductor wafer, the first shot including a plurality of elongated chip patterns, the plurality of elongated chip patterns being arranged in parallel to each other and exposing a second shot to light on the semiconductor wafer, the second shot including a plurality of elongated chip patterns, so that the plurality of elongated chip patterns of the second shot and the plurality of elongated chip patterns of the first shot are arranged perpendicular to each other. The plurality of elongated chip patterns of the second shot are generated by rotating the plurality of elongated chip patterns of the first shot by 90 degrees. |
