| 摘要 |
PROBLEM TO BE SOLVED: To reuse a support plate supporting a substrate to be thinned. SOLUTION: By using a method of treating the support plate, the support plate supporting the substrate to be thinned is treated by being bonded to the substrate. The method includes one of three processes, namely a process for treating the substrate with the substrate bonded to the support plate, separating the support plate from the substrate, and then immersing the support plate into a chemical liquid, a process for applying dry plasma to the support plate, and a process for polishing the support plate. COPYRIGHT: (C)2008,JPO&INPIT |
