发明名称
摘要 PROBLEM TO BE SOLVED: To provide thermal treatment equipment which can efficiently heat a substrate to a prescribed temperature in a wide temperature range and without occurrence of a fault. SOLUTION: The thermal treatment equipment heat-treats the substrate and is provided with a substrate supporting means having a support where the substrate is placed on the surface and holes are formed on the surface and a gas supply part supplying gas jetted from the holes of the support and floating and supporting the substrate by jetting of gas from the holes, a heating object arranged facing the support in a direction opposite to the surface of the support, and a heating means arranged in the direction opposite to the surface of the support to heat the heating object. The heating means heats the heating object and the support is heated. The substrate is heated to the prescribed temperature. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP5021347(B2) 申请公布日期 2012.09.05
申请号 JP20070079404 申请日期 2007.03.26
申请人 发明人
分类号 H01L21/324;H01L21/683 主分类号 H01L21/324
代理机构 代理人
主权项
地址