| 摘要 |
PURPOSE: An apparatus and method for dicing a wafer are provided to efficiently divide a die of a wafer during a wafer dicing process. CONSTITUTION: A chuck table(110) is formed including a vertical through hole(112) and a horizontal groove(114). The horizontal groove is formed in order to be opened to an outer side surface of the chuck table. A sliding unit(130) comprises a sliding bar(132), a central bar(134), and a rotary unit(136). The sliding unit applies tensile force in a reforming area formed between dies(10a) of a wafer(10). The sliding bar formed of a cylindrical shaped bar having a predetermined diameter.
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