| 摘要 |
<p>The invention provides a method of smoothing the outline of a useful layer (66) of material transferred to a support substrate (7), said method comprising at least one step of molecular bonding the front face (600) of a source substrate (6) to the receiving face (700) of a support substrate (7), and a step of transferring a useful layer (66) deriving from said source substrate (6) onto said support substrate (7). This method is characterized in that prior to said bonding step, at least one of the faces selected from said front face (600) and said receiving face (700) undergoes a machining operation intended to form a shoulder (61) over at least a portion of its periphery, said shoulder (61) defining an inner projecting zone (62) the top face (620) of regular outline (C" 6 ) so that after bonding, said useful layer (66) is transferred to said support substrate (7) with a regular outline. Application to the fabrication of a composite substrate for optics, electronics or optoelectronics.</p> |
