| 摘要 |
There are provided a conductive material having a first metal and a second metal whose diffusibility in a soldering step is so good that a high-melting point intermetallic compound is generated at a low temperature and in short time, leaving no first metal after soldering and having excellent strength in high temperature when used as a solder paste for example, and a bonding method and a bonded structure with high bonding reliability using the same. The conductive material should include a metal component consisting of a first metal and a second metal having a melting point higher than that of the first metal, wherein the first metal is Sn or an alloy containing 70% by weight or more of Sn, and the second metal is a metal or alloy which forms an intermetallic compound showing a melting point of 310°C or higher with the first metal and has a lattice constant difference of 50% or greater between itself and the intermetallic compound generated at the circumference of the second metal. In addition, the ratio of the second metal to the metal component is 30% by volume or greater. A Cu-Mn alloy or a Cu-Ni alloy is used as the second metal. |
