发明名称 SOI SUBSTRATE AND METHOD FOR PRODUCING SAME
摘要 This SOI substrate includes a base substrate which includes a single-crystal semiconductor and an active layer which includes a single-crystal semiconductor and is bonded to the base substrate with an oxide film therebetween. The oxide film is formed only in the active layer. The active layer is formed with a thickness of 10 to 200 nm and a thickness variation throughout the active layer of 1.5 nm or less by etching a surface of the active layer while selectively using only the reactive radicals generated by a plasma etching process.
申请公布号 EP1758168(A4) 申请公布日期 2012.09.05
申请号 EP20050743926 申请日期 2005.05.25
申请人 SUMCO CORPORATION 发明人 MORITA, ETSUROU;SANO, RITAROU;ENDO, AKIHIKO
分类号 H01L27/12;H01L21/02;H01L21/3065;H01L21/762 主分类号 H01L27/12
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