DRY ETCHING APPARATUS USING WAVE

摘要

PURPOSE: A dry etching apparatus using waves is provided to easily discharge an etching by-product of an etched sacrificial layer to the outside by vibrating a vacuum chamber and a holder with an ultrasonic frequency when the sacrificial layer between a substrate and an element is removed. CONSTITUTION: A holder(120) is formed in a vacuum chamber(110). A peeled object(130) is composed of a substrate(131) and an element(137). A sacrificial layer(135) is formed between the substrate and the element. The sacrificial layer is etched by etching gas flowing into the vacuum chamber. A wave generator(140) is attached in the vacuum chamber and vibrates with a sound wave or an ultrasonic frequency. [Reference numerals] (AA) Etching gas