发明名称 |
CERAMIC SUBSTRATE FOR PROBE CARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PURPOSE: A ceramic substrate for a probe card and a manufacturing method thereof are provided to obtain connection of an electrode pad and a via electrode by forming the electrode pad on the via electrode which is exposed to one side of the ceramic substrate. CONSTITUTION: A ceramic substrate(10) with a plurality of via electrodes(11) is prepared. An electrode pad(20), which is electrically connected to a via electrode exposed to one side of the ceramic substrate, is formed. A polymer layer(30) is formed on one side of the ceramic substrate in order to surround the electrode pad. The polymer layer is ground. A plurality of outer layer pads, which is electrically connected to the electrode pad, is formed on the polymer layer.
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申请公布号 |
KR20120097609(A) |
申请公布日期 |
2012.09.05 |
申请号 |
KR20110016917 |
申请日期 |
2011.02.25 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHOI, YONG SEOK;LEE, DAE HYEONG;CHANG, MYUNG WHUN;MA, WON CHUL;HONG, KI PYO |
分类号 |
H01L21/66;H05K3/46 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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