发明名称 CERAMIC SUBSTRATE FOR PROBE CARD AND METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: A ceramic substrate for a probe card and a manufacturing method thereof are provided to obtain connection of an electrode pad and a via electrode by forming the electrode pad on the via electrode which is exposed to one side of the ceramic substrate. CONSTITUTION: A ceramic substrate(10) with a plurality of via electrodes(11) is prepared. An electrode pad(20), which is electrically connected to a via electrode exposed to one side of the ceramic substrate, is formed. A polymer layer(30) is formed on one side of the ceramic substrate in order to surround the electrode pad. The polymer layer is ground. A plurality of outer layer pads, which is electrically connected to the electrode pad, is formed on the polymer layer.
申请公布号 KR20120097609(A) 申请公布日期 2012.09.05
申请号 KR20110016917 申请日期 2011.02.25
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHOI, YONG SEOK;LEE, DAE HYEONG;CHANG, MYUNG WHUN;MA, WON CHUL;HONG, KI PYO
分类号 H01L21/66;H05K3/46 主分类号 H01L21/66
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