Semiconductor dice having a shielded area created under bond wires connecting pairs of bonding pads

摘要

An integrated circuit comprises a semiconductor die including N bond pad pairs each including a first bond pad and a second bond pad that is spaced from the first bond pad. N bond wires are associated with a respective one of the N bond pad pairs. Each of the bond wires have opposite ends that communicate with the first and second bond pads of a respective one of the N bond pad pairs. The first and second bond pads of the N bond pad pairs are connected to a reference potential and create a shielded area between the N bond pad pairs.