发明名称 |
Construction of reliable stacked via in electronic substrates—vertical stiffness control method |
摘要 |
A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing supporting the plurality of stacked vias. The platted through hole landing includes a compliant center zone; and spring-like stiffness-reducing connectors for connecting the compliant center zone of the platted through hole landing. |
申请公布号 |
US8258410(B2) |
申请公布日期 |
2012.09.04 |
申请号 |
US20080020534 |
申请日期 |
2008.01.26 |
申请人 |
KACKER KARAN;POWELL DOUGLAS O.;QUESTAD DAVID L.;RUSSELL DAVID J.;SRI-JAYANTHA SRI M.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KACKER KARAN;POWELL DOUGLAS O.;QUESTAD DAVID L.;RUSSELL DAVID J.;SRI-JAYANTHA SRI M. |
分类号 |
H05K1/11;H05K1/09 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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